| PCBA Capabilities |
| Turnkey PCBA | PCB+components sourcing+assembly+package |
| Assembly details | SMT and Thru-hole, ISO SMT and DIP lines |
| Lead Time | Prototype : 15 work days. Mass order : 20~25 work days |
| Testing on products | Testing jig/mold , X-ray Inspection, AOI Test, Functional test |
| Quantity | Min quantity : 1pcs. Prototype, small order, mass order, all OK |
| Files needed | PCB : Gerber files(CAM, PCB, PCBDOC)
Components : Bill of Materials(BOM list)
Assembly : Pick-N-Place file |
| PCB Panel Size | Min size : 0.25*0.25 inches(6*6mm)
Max size : 1200*600mm |
| Components details | Passive Down to 0201 size
BGA and VFBGA
Leadless Chip Carriers/CSP
Double-sided SMT Assembly
Fine Pitch to 0.8mils
BGA Repair and Reball
Part Removal and Replacement |
| Component package | Cut Tape, Tube, Reels, Loose Parts |
| PCB+ assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave
Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
PCBA Products Show by Linked Electronics
Linked Electronics provides one-stop PCB/PCBA customization services. To meet all of customer's PCB/PCBA requirement is the goal that we pursue
1.To offer good quality PCB/PCBA to our customer, we will do many kind of testing to ensure quality before shipment
2.Outgoing test to check min PTH Cu thickness, Min surface Cu thickness, ENIG Au data,Ni data, Au layer adhesion testing, soldermask adhesion testing, silkscreen adhesion testing, Thermal stress testing, hardness testing, Twist testing, Bow testing
3.Microsection testing to check hole Cu thickness, Surface Copper thickness, Wrap copper thickness, Hole Wall Integrity, soldermask thickness and stack up.
4.E-test to inpsect any open/short circuit.
5.Thermal Stress Test to avoid any Delamination, Measling and others.
6.Solderability of PTH to avoid any discolor, Wrinkles, Blisters, Measling, Blow-Hole, Solermask peel off, and soldermask filled in hole-wall incompletely.
7. Outgoing and microsection report will be sent with the PCBs.
